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Silicon talent, from spec to tapeout.

Design, verification, physical implementation and fab — we place the engineers who close timing, hit coverage and get parts to tapeout on schedule.

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Sector engagementlive
  1. 01How we staff a design team
  2. 02Across the full flow
  3. 03Why teams call us
  4. 04When we fit
  • RTL and SoC design: SystemVerilog/Verilog, microarchitecture, IP integration and low-power design in UPF
  • Verification: UVM, formal, emulation and FPGA prototyping, assertion-based and coverage-driven sign-off
  • Physical design and DFT: floorplanning, place-and-route, STA timing closure, scan and BIST
  • Analog and mixed-signal: AMS design, characterization, SerDes, PLLs and high-speed IO
  • Fab, process and yield: process integration, TCAD, lithography and etch equipment, failure analysis
  • Test and packaging: ATE program development, product engineering, and advanced 2.5D/3D and chiplet packaging

A missed tapeout window costs you a product cycle and a mask set at once. Bench FX places semiconductor engineers who have shipped silicon before: RTL and analog designers, UVM verification leads, physical design and DFT specialists, and the process, yield and test engineers who carry a design from GDSII to volume. We recruit against your node, PDK and tool flow — not a generic job description — so candidates arrive fluent in the environment they'll ship in.

  • RTL and SoC design: SystemVerilog/Verilog, microarchitecture, IP integration and low-power design in UPF
  • Verification: UVM, formal, emulation and FPGA prototyping, assertion-based and coverage-driven sign-off
  • Physical design and DFT: floorplanning, place-and-route, STA timing closure, scan and BIST
  • Analog and mixed-signal: AMS design, characterization, SerDes, PLLs and high-speed IO
  • Fab, process and yield: process integration, TCAD, lithography and etch equipment, failure analysis
  • Test and packaging: ATE program development, product engineering, and advanced 2.5D/3D and chiplet packaging

How we staff a design team

Give us the block and the schedule. We screen for the specifics — SystemVerilog and UVM depth, timing closure at advanced nodes, low-power intent in UPF, or ATE program experience — and put vetted engineers in front of your leads in days, not months.

Across the full flow

Front-end design, verification, physical implementation, DFT, analog and mixed-signal, packaging and test, plus the process integration and yield engineers who own the fab side. One partner for the whole silicon lifecycle instead of five.

Why teams call us

Semiconductor talent is scarce and mobile. Our recruiters know the difference between a resume that lists Cadence and an engineer who has actually closed timing on a 5nm block — and we hold confidentiality tight when the tapeout you're staffing hasn't been announced.

When we fit

Ramping a new SoC program, covering a tapeout crunch, standing up a design center, or filling a hard analog or DFT seat that's been open for months. Contract, contract-to-hire or direct placement, matched to how your headcount actually works.

Typical time to first qualified slate
DaysTypical time to first qualified slate
RTL to tapeout to volume, one partner
Full flowRTL to tapeout to volume, one partner
Talent networks across major semiconductor hubs
GlobalTalent networks across major semiconductor hubs

FAQ

Questions, answered.

Related industries

Staff your next tapeout.

Tell us the node, the block and the deadline. We'll put qualified engineers in front of your leads within days.

Request talentTalk to a specialist